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KINGSTON MEMORIA 8GB DDR4 2666 MHZ CL19
MEMORIA - DDR4-2600 - KINGSTON KVR26N19S8-8 - KINGSTON MEMORIA 8GB DDR4 2666 MHZ CL19
DESCRIPTION SPECIFICATIONS
*Power will vary depending on the SDRAM used.
KVR26N19S8/8
8GB 1Rx8 1G x 64-Bit PC4-2666
CL19 288-Pin DIMM
Continued >>
FEATURES
This document describes ValueRAM's KVR26N19S8/8 is a 1G x 64-bit
(8GB) DDR4-2666 CL19 SDRAM (Synchronous DRAM), 1Rx8,
memory module, based on eight 1G x 8-bit FBGA components. The
SPD is programmed to JEDEC standard latency DDR4-2666 timing of
19-19-19 at 1.2V. Each 288-pin DIMM uses gold contact fingers. The
electrical and mechanical specifications are as follows:
CL(IDD)
Row Cycle Time (tRCmin)
Refresh to Active/Refresh
Command Time (tRFCmin)
Row Active Time (tRASmin)
Maximum Operating Power
UL Rating
Operating Temperature
Storage Temperature
19 cycles
45.75ns(min.)
350ns(min.)
32ns(min.)
TBD W*
94 V - 0
0o
C to +85o
C
-55o
C to +100o
C
Power Supply: VDD=1.2V Typical
VDDQ = 1.2V Typical
VPP - 2.5V Typical
VDDSPD=2.2V to 3.6V
Nominal and dynamic on-die termination (ODT) for
data, strobe, and mask signals
Low-power auto self refresh (LPASR)
Data bus inversion (DBI) for data bus
On-die VREFDQ generation and calibration
Single-rank
On-board I2 serial presence-detect (SPD) EEPROM
16 internal banks; 4 groups of 4 banks each
Fixed burst chop (BC) of 4 and burst length (BL) of 8
via the mode register set (MRS)
Selectable BC4 or BL8 on-the-fly (OTF)
Fly-by topology
Terminated control command and address bus
PCB: Height 1.23 (31.25mm)
RoHS Compliant and Halogen-Free
https://www.kingston.com/dataSheets/KVR26N19S8_8.pdf
*Power will vary depending on the SDRAM used.
KVR26N19S8/8
8GB 1Rx8 1G x 64-Bit PC4-2666
CL19 288-Pin DIMM
Continued >>
FEATURES
This document describes ValueRAM's KVR26N19S8/8 is a 1G x 64-bit
(8GB) DDR4-2666 CL19 SDRAM (Synchronous DRAM), 1Rx8,
memory module, based on eight 1G x 8-bit FBGA components. The
SPD is programmed to JEDEC standard latency DDR4-2666 timing of
19-19-19 at 1.2V. Each 288-pin DIMM uses gold contact fingers. The
electrical and mechanical specifications are as follows:
CL(IDD)
Row Cycle Time (tRCmin)
Refresh to Active/Refresh
Command Time (tRFCmin)
Row Active Time (tRASmin)
Maximum Operating Power
UL Rating
Operating Temperature
Storage Temperature
19 cycles
45.75ns(min.)
350ns(min.)
32ns(min.)
TBD W*
94 V - 0
0o
C to +85o
C
-55o
C to +100o
C
Power Supply: VDD=1.2V Typical
VDDQ = 1.2V Typical
VPP - 2.5V Typical
VDDSPD=2.2V to 3.6V
Nominal and dynamic on-die termination (ODT) for
data, strobe, and mask signals
Low-power auto self refresh (LPASR)
Data bus inversion (DBI) for data bus
On-die VREFDQ generation and calibration
Single-rank
On-board I2 serial presence-detect (SPD) EEPROM
16 internal banks; 4 groups of 4 banks each
Fixed burst chop (BC) of 4 and burst length (BL) of 8
via the mode register set (MRS)
Selectable BC4 or BL8 on-the-fly (OTF)
Fly-by topology
Terminated control command and address bus
PCB: Height 1.23 (31.25mm)
RoHS Compliant and Halogen-Free
https://www.kingston.com/dataSheets/KVR26N19S8_8.pdf
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